MULTI-CHIP SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip semiconductor device which has a small plan area and excellent thermal dissipation.

SOLUTION: In the multi-chip semiconductor device constituted by laminating chips 11, 12and 13having silicon substrates 2 on which elements are integrally formed, a connecting substrate 311having through-holes in which conductive plugs 4 are formed is provided between the two upper and lower adjoining chips 11and 12. The chips 11and 12are electrically connected through the conductive plugs 4. A metal plate 32 with a higher thermal conductivity than that of the connecting substrate 311is provided therein. The chips 12and 13are connected and improved in thermal dissipation by a similar technique.

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