| 摘要 |
PROBLEM TO BE SOLVED: To control a crack generated at a plate portion around a lead pin in an input/output terminal connecting the lead pin to a through hole of the plate portion through a cement. SOLUTION: A semiconductor element housing package is mounted as if it surrounds a substrate 1 having a loading portion 1a loaded by a semiconductor element A and the loading portion 1a, and is provided with a metal frame body 2 at whose side portions a plurality of through holes are formed and with a flat plate-shaped input/output terminal 3 consisting of a ceramics. The input/output terminal 3 is constituted of the plate portion 3a plurally formed so as for a through hole 7 with smaller diameter than a through hole 2a to accord its central axis to a central axis of the through hole 2a each, a circular metal layer 3a-B provided at the periphery of other main face side opening of the through hole 7 each, a metal circular member 5 connected to the metal layer 3a-B, and the lead pin 4 connected to each inner face of the circular member 5 and the through hole 7 by inserting and communicating the through hole 7 and the through hole 2a. COPYRIGHT: (C)2004,JPO&NCIPI
|
