BONDING PAD OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A bonding pad of a semiconductor device is provided to concentrate pressure stress generated in a bonding process on the surface of a pad by forming unevenness of an embossed type on the pad in a CMP(chemical mechanical polishing) process. CONSTITUTION: An uppermost metal layer and an uppermost via hole are uniformly distributed in a bonding pad of a semiconductor device. The concave part and the convex part of the uppermost metal layer are formed of an embossed type. The uppermost metal layer constitutes a concave part in a region of a horizontal via hole(40).