| 摘要 |
PROBLEM TO BE SOLVED: To increase uniformity of film thickness of a plating film by enabling more uniform supply of electric current to a power-feeding part of a substrate from substantially all around the substrate. SOLUTION: An electrolytic plating apparatus is equipped with a power-feeding electrode 40 which is electrically connected to an external electrode and contacts the power-feeding part S of the substrate to feed power to it. The power-feeding electrode 40 has at least one conducting layer 44 formed on the surface of an elastic base material 42. The power-feeding electrode 40 preferably has a ring shape and contacts the power-feeding part S of the substrate W at the entire circumference of the substrate W. This enables more uniform supply of electric current to the power-feeding part S of the substrate W from substantially all around the substrate W. COPYRIGHT: (C)2004,JPO&NCIPI
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