发明名称 RIGID FLEXIBLE MULTI-LAYER PRINTED-WIRING BOARD AND METHOD FOR ACCOMMODATING THE SAME IN CASE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an accommodation method that eliminates plays and folds at an inner-periphery side occurring while bending a flexible section when bending a rigid flexible wiring board for accommodating in a case, and further can reduce a total thickness when bending the flexible section for accommodating a rigid flexible multi-layer printed-wiring board in the case; and to provide the rigid flexible multi-layer printed circuit board. <P>SOLUTION: In the rigid flexible multi-layer printed circuit board, at least two flexible sections are pulled out of one rigid section 4, and a portion where the pulled flexible sections 2, 3 are to be extended is connected to the other rigid section 5 integrally. The flexible sections are bent nearly in an S shape for accommodating in the case. At one of the rigid sections, a recessed groove is provided where the recessed groove accommodates and retains one portion when the flexible section is bent nearly in the S shape. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004221222(A) 申请公布日期 2004.08.05
申请号 JP20030005322 申请日期 2003.01.14
申请人 CMK CORP 发明人 TOKIWA TADASHI
分类号 H05K5/00;H05K1/14;H05K3/46;H05K7/14;(IPC1-7):H05K7/14 主分类号 H05K5/00
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