发明名称 METHOD FOR MANUFACTURING PREPREG, PREPREG, LAMINATE WITH BUILT-IN INNER LAYER CIRCUIT AND METAL FOIL-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a prepreg which can prevent voids from being generated in a laminate with a built-in inner layer circuit and also can prevent the laminates from slipping at a position of the prepreg when two or more laminates are sandwiched between hot platens and thermally pressurized, and a method for manufacturing the prepreg, the laminate with a built-in inner layer circuit manufactured using the prepreg and a metal foil-clad laminate. SOLUTION: This prepreg is manufactured by passing a base 1 impregnated with varnish between a pair of squeeze rolls 3A and 3B which rotate the base 1 in the same direction in the way that an outer resin layer on one surface is thicker than an outer resin layer on the other surface. The method for manufacturing the prepreg is to manufacture the prepreg by passing the base 1 impregnated with varnish between the paired squeeze rolls 3A and 3B which rotate the base 1 in the same direction. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004216784(A) 申请公布日期 2004.08.05
申请号 JP20030008942 申请日期 2003.01.17
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 OTO NORIYASU;SUZUE TAKAYUKI
分类号 B29B11/16;B29K63/00;B32B15/08;H05K3/46;(IPC1-7):B29B11/16 主分类号 B29B11/16
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