| 发明名称 |
Substrate monitoring during chemical mechanical polishing |
| 摘要 |
Methods and apparatus for monitoring a substrate surface during chemical mechanical polishing are disclosed.
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| 申请公布号 |
US2004152396(A1) |
申请公布日期 |
2004.08.05 |
| 申请号 |
US20030358852 |
申请日期 |
2003.02.04 |
| 申请人 |
APPLIED MATERIALS, INC |
发明人 |
WISWESSER ANDREAS NORBERT;BIRANG MANOOCHER;SWEDEK BOGUSLAW A. |
| 分类号 |
B24B37/04;B24B49/12;(IPC1-7):B24B49/12 |
主分类号 |
B24B37/04 |
| 代理机构 |
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