| 摘要 |
PROBLEM TO BE SOLVED: To reduce the difference of peak temperature between components due to heating in a reflow furnace soldering lead components. SOLUTION: One side reflow 3 is provided with a heater 11 and components cooling part 12, heats and solders the whole soldering surface while cooling the components surface of a substrate 6. A spot reflow 4 is provided in a rear stage of the one side reflow 3. The spot reflow 4 is provided with a spot heater 15 provided with a nozzle 16a in accordance with the arrangement of soldering part of a specific lead component restrained from the rise in the temperature on the substrate 6. The spot reflow 4 reheats the soldering part of the specific lead component restrained from a rise in a temperature to the substrate 6 soldered in the one side reflow 3. Consequently, the difference of the peak temperature can be reduced between the components due to heating. COPYRIGHT: (C)2004,JPO&NCIPI
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