ADHESIVE FILM FOR PROTECTING REAR SURFACE OF SEMICONDUCTOR WAFER AND METHOD FOR PROTECTING SEMICONDUCTOR WAFER USING ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a protective method of a semiconductor wafer in which the semiconductor wafer can be protected against damage even when it is made as thin as≤200μm. SOLUTION: The adhesive film for protecting the rear surface of a semiconductor wafer has an adhesive layer 3-100μm in thickness formed on one surface of a substrate film layer including at least one layer of high rigidity film having an elastic modulus of≥1×108Pa and a thickness of 20-200μm. The semiconductor wafer can be imparted with a protective function by pasting the adhesive film to the rear surface thereof. COPYRIGHT: (C)2004,JPO&NCIPI