ELECTROSTATIC CHUCK WAFER PORT AND TOP PLATE WITH EDGE SHIELDING AND GAS SCAVENGING
摘要
An apparatus for processing a semiconductor wafer. The apparatus according to the present invention comprises a wafer port flange including an electrostatic chuck and a top plate including a lip. The electrostatic chuck defines a circumferential gas distribution groove and a gas gap positioned between a backside of a semiconductor wafer and the electrostatic chuck. The lip is positioned to shield an outside band of the wafer. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
申请公布号
WO2004038766(A3)
申请公布日期
2004.07.22
申请号
WO2003IB04652
申请日期
2003.10.22
申请人
AXCELIS TECHNOLOGIES, INC.
发明人
KELLERMAN, PETER, L.;RYAN, KEVIN, T.;MITCHELL, ROBERT, J.