| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device by which defective COF bonding is removed and the temperature of a heating tool is increased, and in which an insulating film bonded in a short time is used as a COF tape base material. SOLUTION: In the tape carrier for the semiconductor device, a wiring pattern 10 containing a lead for COF connection is formed on the tape base material 1 composed of the insulating film made of a resin and the lead 10b for the wiring pattern is plated 11 for being heat-joined to a semiconductor chip 7 by pressing by the heating tool 9 from a surface on the reverse side of the tape base material in the lead 10b, a material having a dynamic elastic modulus of 1.5 GPa or more is used as the insulating film constituting the tape base material 1. COPYRIGHT: (C)2004,JPO&NCIPI
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