| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper metallized composition of which a conductor loss is reduced, capable of forming a through conductor having a fine diameter of 10 to 100μm, and to provide a ceramic wiring board using the same. SOLUTION: The through conductor, made of a copper metallized composition containing powder as metal component powder covered by 1 to 5 parts by mass of alumina, silica, magnesia, zirconia, calcia, zinc oxide, or a mixture of the same on the surface of 100 parts by mass of copper powder with an average grain diameter of 0.1 to 3μm, is formed at the inside of an insulation base board formed by laminating a plurality of insulation layers made of glass ceramic. COPYRIGHT: (C)2004,JPO&NCIPI
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