发明名称 RESIST MATERIAL AND METHOD FOR FORMING PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist material and a method for forming a pattern by which a resist pattern with high sensitivity and high resolution can be stably formed in the process of forming a thick positive resist pattern by exposing to UV rays at &ge;300 nm wavelength on a substrate coated with a metal. <P>SOLUTION: The resist material contains: (A) a polymer compound having a repeating unit expressed by formula (1) and an acid unstable group; (B) an acid generating agent comprising (5-(4-methylpenyl)sulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl)acetonitrile or the like; and (C) benzotriazoles. UV rays at &ge;300 nm wavelength are used as the exposure light source. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004198944(A) 申请公布日期 2004.07.15
申请号 JP20020370106 申请日期 2002.12.20
申请人 SHIN ETSU CHEM CO LTD 发明人 KATO HIDETO;NODA KAZUMI
分类号 G03F7/039;G03F7/004;G03F7/022 主分类号 G03F7/039
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