| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the attenuation of a high frequency signal in a multilayer wiring board having a high frequency transmitter for transmitting the high frequency signal via upper and lower wiring conductor layers disposed vertically oppositely via an insulation layer interposed between the upper and lower wiring conductor layers. <P>SOLUTION: This multilayer wiring board includes the high frequency transmitter for transmitting the high frequency signal via the wiring conductor layers 2 disposed vertically oppositely via the insulation layer 3 interposed between a high frequency conductor layer 5 and a close contact metal layer 4 disposed on the at least lower surface of the conductor layer 5. In opposed surfaces of the wiring conductor layers 2 in the high frequency transmitter, surface resistance including the influence of the close contact metal layer 4 disposed on the opposed surface side to the surface resistance with respect to the surface resistance caused by a skin effect to the high frequency signal of the high frequency conductor layer 5 is set to 1.5 times or less as large as the surface resistance caused by the skin effect. Since the conductor loss which largely affects the transmission loss α is reduced, the multilayer wiring board having excellent high speed transmission characteristics is obtained. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
