发明名称 |
CASE FOR SURFACE MOUNT PART, SURFACE MOUNT ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To prevent generation of a weld line and distortion when molding a case. SOLUTION: A case 20 for a surface mount part is molded by a resin injection in a mold cavity, and used for housing an electronic part element. A gate port 39 is arranged between a place separated at a distance of the quarter of the overall length of the case from one end in the case longitudinal direction and a place separated at a distance of one over three of the overall length of the case from one end. A beltlike thick section 41 extended in the case longitudinal direction is formed to a top plate 30. Grooves 42 extending in the height direction are formed to a side wall 31.A chamfering section is formed at a case-inside corner partitioned by the internal surface of the top plate and the internal surface of the side wall. The chamfering section is formed at the case-inside corner partitioned by the internal surface of an end wall positioned far from the gate port and the internal surface of the case top plate. COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004193372(A) |
申请公布日期 |
2004.07.08 |
申请号 |
JP20020360042 |
申请日期 |
2002.12.11 |
申请人 |
TDK CORP |
发明人 |
TAKEDA GENTARO;FUKUDA TADASHI;KINOSHITA KAZU;YASUDA MITSUTAKA;SASAI HIROSHI |
分类号 |
H05K5/00;B29C45/14;B29C45/26;B29L31/34;H01F27/02;H01L23/02;(IPC1-7):H01L23/02 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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