发明名称 Metal/ceramic circuit board
摘要 There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 mum.
申请公布号 US2004131832(A1) 申请公布日期 2004.07.08
申请号 US20030713390 申请日期 2003.11.14
申请人 TSUKAGUCHI NOBUYOSHI;KIMURA MASAMI 发明人 TSUKAGUCHI NOBUYOSHI;KIMURA MASAMI
分类号 H01L23/373;H05K1/03;H05K3/06;H05K3/24;H05K3/38;(IPC1-7):B32B3/00 主分类号 H01L23/373
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