发明名称 |
Metal/ceramic circuit board |
摘要 |
There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 mum.
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申请公布号 |
US2004131832(A1) |
申请公布日期 |
2004.07.08 |
申请号 |
US20030713390 |
申请日期 |
2003.11.14 |
申请人 |
TSUKAGUCHI NOBUYOSHI;KIMURA MASAMI |
发明人 |
TSUKAGUCHI NOBUYOSHI;KIMURA MASAMI |
分类号 |
H01L23/373;H05K1/03;H05K3/06;H05K3/24;H05K3/38;(IPC1-7):B32B3/00 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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