发明名称 |
System for chemical mechanical polishing comprising an improved pad conditioner |
摘要 |
A system and method for chemical mechanical polishing of a substrate is disclosed in which a polishing pad is conditioned by directing a fluid jet to the surface of the polishing pad. Thus, the use of expensive consumables, like conditioning pads comprising diamonds, can be avoided. Furthermore, the risk of substrates being scratched by diamonds lost from the conditioning pad is avoided.
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申请公布号 |
US2004132388(A1) |
申请公布日期 |
2004.07.08 |
申请号 |
US20030609096 |
申请日期 |
2003.06.27 |
申请人 |
KUHN MATTHIAS;LINGEL STEFAN |
发明人 |
KUHN MATTHIAS;LINGEL STEFAN |
分类号 |
B24B37/04;B24B53/007;B24B53/017;(IPC1-7):B24B1/00;B24B21/18 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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