PACKAGE WHICH PREVENTS EMC FROM INTRUDING INTO VIA HOLE DURING MANUFACTURE OF PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A package and a method for manufacturing the same are provided to manufacture packages for an infrared data association by using a printed circuit board using a blind via hole. CONSTITUTION: A method for manufacturing a package, comprises a step of processing through holes on a printed circuit board; a step of performing a copper plating(53) on the printed circuit board; a step of filling the through holes with an insulating material(54); a step of forming a blind via hole(55) by removing the insulating material from the bottom to the top of the printed circuit board; and a step of forming a conductive layer all over the surface of the printed circuit board and the inner wall of the blind via hole by performing a plating process on the printed circuit board.