发明名称 Nonleaded solder alloy and electronic parts using it
摘要 Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire having an insulating coating, the core wire thereof being copper or a copper alloy, and in which electronic components distances between neighboring terminals are narrow. Electric wire having an insulating coating, the base metal of which is copper, and terminal portions (connection portions) are soldered together by means of a lead-free solder alloy, which contains 3.0 to 5.5 wt % copper (Cu); 0.1 to 0.5 wt % nickel (Ni); and 0.001 to 0.1 wt % germanium (Ge), the remainder of the solder alloy consisting of tin (Sn).
申请公布号 US2004126270(A1) 申请公布日期 2004.07.01
申请号 US20030433461 申请日期 2003.06.03
申请人 IZUMIDA KOICHI;TAKANO YUKI;ABE HITOSHI;MORIBAYASHI TOSHIYUKI;HAGIO KOICHI;TAKENAKA JUNICHI 发明人 IZUMIDA KOICHI;TAKANO YUKI;ABE HITOSHI;MORIBAYASHI TOSHIYUKI;HAGIO KOICHI;TAKENAKA JUNICHI
分类号 B23K35/26;(IPC1-7):C22C13/00 主分类号 B23K35/26
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