发明名称 Process for manufacturing a housing for sensor elements, sensor and use thereof
摘要 For manufacturing a housing for sensor elements, a pliable material is introduced into the environment of the sensor element (2) by an injection molding process. In a first process step, the sensor element is injection-encapsulated by a soft plastic component (1), and in a second process step a hard plastic component (5) is applied thereon, which forms the outer housing for the sensor element (2). The sensor element (2) is provided with at least two connection leads (11), which are at least partially encapsulated by the soft plastic component (1). A sensor manufactured according to the process, especially a temperature sensor, is provided with a measuring resistor as a sensor element (2) on a substrate with an electrically conducting surface and the resistance layer situated thereon. The measuring resistor is encased by the soft plastic component (1), which in turn is encapsulated in a hard plastic component serving as a housing.
申请公布号 US6756585(B2) 申请公布日期 2004.06.29
申请号 US20020094245 申请日期 2002.03.08
申请人 HERAEUS ELECTRO-NITE INTERNATIONAL N.V. 发明人 DAMASCHKE GERHARD
分类号 G01D11/24;(IPC1-7):H01J40/14;H01J7/24;H01L31/08;H01L29/267 主分类号 G01D11/24
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