发明名称 Wafer transport pod with linear door opening mechanism
摘要 A pod for transporting a cassette of semiconductor wafers that is equipped with a linearly operated door opening/closing mechanism is provided. The pod includes a body member, a cover member and a latch carried on the covet member for latching the cover member onto the body member. The latch is actuatable and operable linearly from a latched condition in which the cover member is latched onto the body member to a released condition allowing removal of the cover member from the body member when engaged linearly by a latch key of a door opener situated in a loadport onto which the cassette pod is positioned.
申请公布号 US6755602(B2) 申请公布日期 2004.06.29
申请号 US20020072704 申请日期 2002.02.07
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD 发明人 TSENG HSIEN-HUA;CHUNG CHIA-HUNG
分类号 H01L21/673;H01L21/677;(IPC1-7):B65G49/07 主分类号 H01L21/673
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