| 摘要 |
PROBLEM TO BE SOLVED: To obtain a process for manufacturing a liquid ejection head applicable to a thermal ink jet printer, for example, and suitable for a semiconductor production process in which tolerance against a liquid to be processed can be enhanced easily. SOLUTION: A metal protective layer touching a liquid is deposited at a substrate temperature of 230 degree or above or left in an atmosphere of 230 degree or above for a specified time. COPYRIGHT: (C)2004,JPO
|
