发明名称 ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To dissipate heat from an exothermic module efficiently for the heat from the module not to affect one other module, and, also, to dissipate heat from the other module efficiently. SOLUTION: The inside of a case 1 is divided by a partition plate 2 having a backboard 5 attached thereto into a front-side lowly exothermic module housing section 3 and a rear-side highly exothermic module housing section 4. The case 1 is provided with an air intake port 23 communicating with the lower part of the highly exothermic module housing section 4, and with an exhaust port 27 communicating with the upper part of the highly exothermic module housing section 4. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004179308(A) 申请公布日期 2004.06.24
申请号 JP20020342451 申请日期 2002.11.26
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKAYASU TETSUFUMI;SAKAMOTO YUZURU
分类号 H05K7/20;H01L23/467;(IPC1-7):H05K7/20 主分类号 H05K7/20
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