| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for connecting metal films on the surface and the back of a substrate without disconnecting them in a manufacturing method of a membrane structure type high frequency circuit. SOLUTION: After sheath metal layers 106, 107 are formed over the entire back surface of the substrate including a membrane structure part, a resist 202 is formed on the membrane structure, and the metal film 108 is formed over an outer periphery of a through-hole and over the back surface of the substrate. Then, after the resist 202 on the membrane structure part is removed, the resist 203 is again formed on the outer periphery part of the through-hole and on the back surface of the substrate to remove the sheath metal layers 106, 107 of the membrane structure part by wet-etching thereof. COPYRIGHT: (C)2004,JPO
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