PREPREG FOR MULTILAYERED PLATE, LAMINATED SHEET, MULTILAYERED PRINTED CIRCUIT BOARD AND PRODUCTION THEREOF

摘要

PURPOSE:To obtain a prepreg for a multilayered plate capable of eliminating the shift of a wiring circuit in a case adapted to a laminated sheet or a multilayered printed circuit board by infiltrating an unbaked PTFE resin into a base material such as glass cloth to hold the same and setting specific voids to the PTFE resin. CONSTITUTION:A glass cloth base material 2 with a wt. basis of 48g/m<2> is impregnated with a 60% dispersion of a PTFE resin 3 and dried at 305 deg.C to hold the unbaked PTFE resin on the glass cloth base material 2. This impregnation and low temp. drying treatment are repeated to form a prepreg 4 with resin content of 60-90vol.%. The voids of the resin layer of the prepreg 4 thus formed are 3-15vol.%. When a multilayered printed circuit board is constituted by using the prepreg 4 for a multilayered plate having those voids, press molding is performed in a high temp. and high pressure state to obtain the multilayered printed circuit board high in the close adhesiveness with the base material 2 and having uniform physical property values.