| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern forming method capable of preventing pattern form deterioration of a copper thick film caused by variation in a resist pattern form in a Lithographie Galvanoformung Abformung-like process using a thick film resist layer formed by laminating light-sensitive films. <P>SOLUTION: In the pattern forming method comprising a process for forming the thick film resist layer 25 with a pattern on a substrate 10 by using a mask 30, the thick film resist layer 25 is formed, and then the side faces S of the thick film resist layer 25 are hardened by irradiating the side faces S with an electromagnetic wave. <P>COPYRIGHT: (C)2004,JPO |
