| 发明名称 |
ENCAPSULATION OF PIN SOLDER FOR MAINTAINING ACCURACY IN PIN POSITION |
| 摘要 |
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. |
| 申请公布号 |
EP1430532(A2) |
申请公布日期 |
2004.06.23 |
| 申请号 |
EP20020799643 |
申请日期 |
2002.09.26 |
| 申请人 |
INTEL CORPORATION |
发明人 |
BERRY, MICHELE, J. |
| 分类号 |
H01L21/48;H01L23/498;H05K3/34 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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