| 发明名称 |
Chip scale package with thermally and electrically conductive pad and manufacturing method thereof |
| 摘要 |
Resin encapsulated chip-scale package in which contact pads (13) of a chip (12) are connected to respective conductive traces (11A-11D) that are formed on an insulating layer (AF) on the active face of the chip. Heat removal from the device is improved by providing a conductive pad (11D) on the insulating layer. <IMAGE> |
| 申请公布号 |
EP1187205(A3) |
申请公布日期 |
2004.06.23 |
| 申请号 |
EP20010302535 |
申请日期 |
2001.03.20 |
| 申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
SAKAMOTO, NORIAKI;KOBAYASHI, YOSHIYUKI;SAKAMOTO, JUNJI;OKADA, YUKIO;IGARASHI, YUSUKE;MAEHARA, EIJU;TAKAHASHI, KOUJI |
| 分类号 |
H01L23/28;H01L21/48;H01L21/56;H01L21/60;H01L23/12;H01L23/29;H01L23/31;H01L23/36;H01L23/433 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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