发明名称 EPOXY RESIN COMPOSITION AND ITS CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition with excellent solvent solubility, capable to give a cured product with both heat resistance and low dielectric tangent and which can be suitably used for electric insulation, etc., and its cured product. SOLUTION: The epoxy resin contains one or more hydroxy compound residue selected from the group consisting of formulae (1)-(7), wherein k and l represent each an average value of repetition unit of 0-1.5, m and n represent each an integer of 0-3, Y represents an oxygen atom, an optionally alkyl-, phenyl-, biphenyl- or 9-fluorenyl-substituted methylene group wherein the phenyl, naphthyl or biphenyl group may further be substituted with an aromatic nucleus on an alkyl group, and an aromatic polycarboxylic acid residue. The epoxy resin composition contains a polyester having a terminal aryloxycarbonyl group and the epoxy resin, and its cured product is provided. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004169021(A) 申请公布日期 2004.06.17
申请号 JP20030370332 申请日期 2003.10.30
申请人 DAINIPPON INK & CHEM INC 发明人 DEMURA SATOSHI;YAMADA MASAO;FUJIMOTO KOICHI;TAKAHASHI KATSUJI
分类号 C08G63/133;C08G59/42;(IPC1-7):C08G59/42 主分类号 C08G63/133
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