| 摘要 |
PROBLEM TO BE SOLVED: To provide a small semiconductor device on which a semiconductor chip is mounted with the CSP mounting method without an increase in the manufacturing processes through reduction in the manufacturing cost. SOLUTION: In the semiconductor device 200 wherein a semiconductor element 11, wirings 21, 22, 23 of three layers, and a protective film 3 are formed, the wiring 23 of the third layer of the wirings 21, 22, 23 is exposed from an aperture formed in the protection film 3, and the exposed wiring 23 of the third layer is used as a pad 23b for solder bump 6 for the CSP (chip size package). COPYRIGHT: (C)2004,JPO |
