| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board that is effective for thinning of wires and can improve the accuracy of a wiring pattern by preventing an etching margin from becoming thicker in thickness as plating is performed a plurality of times in a build-up printed wiring board in which components can be mounted on via holes and stacked via holes can also be formed. SOLUTION: Since interlayer connection is made by means of a bump formed by etching copper foil 6 constituting two-layered metal foil 5, the plating performed in the conventional method for conducting via holes becomes unnecessary and the etching margin becomes thinner in thickness. Consequently, the printed wiring board that can reduce the thicknesses of wires and can improve the accuracy of the wiring pattern can be provided. COPYRIGHT: (C)2004,JPO |
