发明名称 METHOD FOR PRODUCING PREPREG HAVING ADHESIVE LAYER AND PREPREG HAVING ADHESIVE LAYER
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a prepreg having an adhesive layer, capable of firmly bonding a conductor layer to the prepreg even in the case of using a conductor layer having a smooth surface without roughening treatment and exhibiting high heat-resistance. SOLUTION: A 2nd curable resin is laminated as an adhesive layer on a prepreg composed of a 1st curable resin of B-stage containing reinforcing fibers. The lamination of the 2nd curable resin on the prepreg is carried out while heating the prepreg and the 2nd curable resin taking care of not to complete the curing of the resin. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004168942(A) 申请公布日期 2004.06.17
申请号 JP20020338382 申请日期 2002.11.21
申请人 HITACHI CHEM CO LTD 发明人 TAKEUCHI KAZUMASA;TANAKA HIROKO;MASUDA KATSUYUKI;TAKAI KENJI
分类号 C08J5/24;C08G73/10;C09J179/08;C09J183/10;(IPC1-7):C08J5/24 主分类号 C08J5/24
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