发明名称 Thermally enhanced semiconductor build-up package
摘要 A semiconductor build-up package includes a die, a metal carrier, and a plurality of dielectric layers. The metal carrier has a surface with a cavity for supporting the die. The surface of metal carrier is coplanar to the active surface of die for building up a plurality of dielectric layers. Each dielectric layer has metal columns for inner electrical connection. The metal carrier covers passive surface and sides of the die with a larger area for heat dissipating, so the heat generated from the die is dissipated fast through the metal carrier.
申请公布号 US6750397(B2) 申请公布日期 2004.06.15
申请号 US20020075226 申请日期 2002.02.15
申请人 ADVANCED SEMICONDUCTOR ENGINEERING, INC. 发明人 OU IN-DE;DING YI-CHUAN;CHEN KUN-CHING
分类号 H01L23/36;H01L23/498;(IPC1-7):H01L23/02 主分类号 H01L23/36
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