发明名称 |
Thermally enhanced semiconductor build-up package |
摘要 |
A semiconductor build-up package includes a die, a metal carrier, and a plurality of dielectric layers. The metal carrier has a surface with a cavity for supporting the die. The surface of metal carrier is coplanar to the active surface of die for building up a plurality of dielectric layers. Each dielectric layer has metal columns for inner electrical connection. The metal carrier covers passive surface and sides of the die with a larger area for heat dissipating, so the heat generated from the die is dissipated fast through the metal carrier.
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申请公布号 |
US6750397(B2) |
申请公布日期 |
2004.06.15 |
申请号 |
US20020075226 |
申请日期 |
2002.02.15 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
OU IN-DE;DING YI-CHUAN;CHEN KUN-CHING |
分类号 |
H01L23/36;H01L23/498;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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