| 摘要 |
PURPOSE: Provided is a liquid phase element protecting material composition for a semiconductor package, which improves the adhesive force between a semiconductor chip or a print circuit board and a liquid phase element protecting material and is low in a linear expansion coefficient, a moisture absorption rate, and a flexural modulus. CONSTITUTION: The liquid phase element protecting material composition contains a liquid phase epoxy resin(A), 0.4-0.5wt.(based on (A)) of a liquid phase alkylated diamino diphenyl methane(B), 0.06-0.10wt.(based on (A)+(B)) of a rubber-modified epoxy resin(C) having an epoxy equivalent of 350-450 and a viscosity of 100-150poise, 0.01-0.05wt.(based on (A)+(B)) of a silicone intermediate(D) having a number average molecular weight of 1000-1500, and 0.70-0.90wt.(based on the total protecting material composition) of an inorganic filler(E). |
