发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high photosensitivity even in a specified wavelength region where an acid generating agent does not function, and in particular, suitable for exposure at 320 to 450 nm. <P>SOLUTION: In the photosensitive composition containing (A) a resin, (B) a photoacid generating agent and (C) a sensitizer, the sensitizer (C) is a compound expressed by general formula (1) which absorbs light at 320 to 450 nm. The photoacid generating agent (B) is a compound (B-1) which does not generate an acid by exposure at 405 nm wavelength. In formula, each of R<SB>1</SB>to R<SB>6</SB>, X, Y independently represents a hydrogen atom or an organic group, either X or Y represents at least an electron withdrawing group, and at least one in R<SB>1</SB>to R<SB>5</SB>represents an electron donating group, and adjacent two groups in R<SB>1</SB>to R<SB>5</SB>may be coupled to form a ring. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004163800(A) 申请公布日期 2004.06.10
申请号 JP20020331916 申请日期 2002.11.15
申请人 MITSUBISHI CHEMICALS CORP 发明人 FUJITA RIEKO;KAMEYAMA YASUHIRO
分类号 G03F7/004;H01L21/027;H05K3/00 主分类号 G03F7/004
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