| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealer composition for use in manufacturing an optical element encapsulating a laser diode, which comprises a methyl phenyl silicone resin and a refractory filler and has sealabilty at lower temperature, a high adhesive strength, a high hermetic seal and a heat resistance, and to provide a molding of the above composition and a sealed structure formed by using the above composition or the above molding, and also to provide an optical element encapsulating a laser diode in the above sealed structure. SOLUTION: The sealer composition for use in the optical element comprises the methyl phenyl silicone resin and the refractory filler, with the methyl phenyl silicone resin having a molar ratio of a bifunctional silicon unit (to the sum total of a bifunctional silicon unit and a trifunctional silicon unit) of 0.03-0.40. The molding for sealing is formed by firstly polymerizing partially and crosslinking the methyl phenyl silicone resin in the above composition, then by molding. The sealed structure is formed by sealing either a glass member and a metal member or metal members each other by using the above composition or the above molding to thereby form a hermetically sealed internal space. Additionally, the optical element encapsulating a laser diode has a structure sealed with the above composition or the above molding. COPYRIGHT: (C)2004,JPO
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