发明名称 WAFER PROCESSING APPARATUS WITH WAFER MAPPING FUNCTION
摘要 PROBLEM TO BE SOLVED: To solve a problem in which trouble occurs in each processing stage when a plurality of wafers are mounted on each stage of a shelf in a pod and a problem in which a wafer can accurately be detected because of the increase of errors when the detection is carried out by moving a sensor by a driving means with an unstable speed, such as an air cylinder, when the sensor is moved by using such a driving means for simpler constitution of a device detecting the wafer. SOLUTION: The wafer processing apparatus is equipped with a transmission sensor 9 for wafer detection, a dock with an index means, and a transmission sensor for the dock. The wafer processing apparatus calculates the rate of the continuation of the signal from the wafer detecting transmission type sensor 9 and the continuation of the signal from the transmission type sensor for the dock corresponding to the index means and compares the ratio with a previously set value to judge the number of wafers 1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004165543(A) 申请公布日期 2004.06.10
申请号 JP20020331868 申请日期 2002.11.15
申请人 TDK CORP 发明人 EMOTO ATSUSHI;KAGAYA TAKESHI;YAMAZAKI KAZUO
分类号 H01L21/67;H01L21/00;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/67
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