Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine

摘要

A cutting device (4) separates wafers from a single crystal (3) with cylindrical formation and a center longitudinal axis/x-axis (M). An orientating device (24) orientates the single crystal in relation to the cutting device. An advance device (23) moves the crystal in an advance direction (V) vertical to its center longitudinal axis in relation to the cutting device. An independent claim is also included for a method for cutting a single crystal in a cutting machine through separating wafers in a single crystal by moving the single crystal in an advance direction relative to a cutting direction.