发明名称 THERMAL-SPRAYED METALLIC CONFORMAL COATINGS USED AS HEAT SPREADERS
摘要 <p>Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.</p>
申请公布号 AU2003272385(A1) 申请公布日期 2004.06.07
申请号 AU20030272385 申请日期 2003.09.15
申请人 PARKER-HANNIFIN CORPORATION 发明人 MIKSA DE SORGO;WILLIAM, G. LIONETTA;SCOTT, M. OPPENHEIM;GEORGE, R. WATCHKO;CHRISTIAN, V. RODRIGUEZ;MATTHEW, T. GAGNON;PETER, W. LIU
分类号 C23C4/00;C23C4/06;C23C4/12;C23C30/00;H05K7/20;H05K9/00;(IPC1-7):H05K7/20 主分类号 C23C4/00
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