发明名称 METHOD FOR MANUFACTURING FLASH MEMORY DEVICE BY USING FURNACE ANNEALING
摘要 PURPOSE: A method for manufacturing a flash memory device is provided to improve the re-write endurance of the flash memory device by reducing stress on flash memory cells. CONSTITUTION: A flash memory cell is formed on a semiconductor substrate(100). A first interlayer dielectric(10) is formed on the flash memory cell. The first interlayer dielectric forming operation is performed at least once or more times by using a furnace annealing as a heat treatment. The first interlayer dielectric has a multi-layer structure. The furnace annealing is performed after a top layer of the multilayer structure is formed. The furnace annealing is performed at a temperature of 600 degrees or higher.
申请公布号 KR20040047539(A) 申请公布日期 2004.06.05
申请号 KR20030043581 申请日期 2003.06.30
申请人 RENESAS TECHNOLOGY CORP. 发明人 MITSUHIRA NORIYUKI
分类号 H01L21/768;H01L21/336;H01L21/8246;H01L21/8247;H01L23/522;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 主分类号 H01L21/768
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