发明名称 |
METHOD FOR MANUFACTURING FLASH MEMORY DEVICE BY USING FURNACE ANNEALING |
摘要 |
PURPOSE: A method for manufacturing a flash memory device is provided to improve the re-write endurance of the flash memory device by reducing stress on flash memory cells. CONSTITUTION: A flash memory cell is formed on a semiconductor substrate(100). A first interlayer dielectric(10) is formed on the flash memory cell. The first interlayer dielectric forming operation is performed at least once or more times by using a furnace annealing as a heat treatment. The first interlayer dielectric has a multi-layer structure. The furnace annealing is performed after a top layer of the multilayer structure is formed. The furnace annealing is performed at a temperature of 600 degrees or higher.
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申请公布号 |
KR20040047539(A) |
申请公布日期 |
2004.06.05 |
申请号 |
KR20030043581 |
申请日期 |
2003.06.30 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
MITSUHIRA NORIYUKI |
分类号 |
H01L21/768;H01L21/336;H01L21/8246;H01L21/8247;H01L23/522;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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