| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing pad having good slurry holding characteristics even if using slurry with a different pH and having excellent polishing characteristics such as a polishing speed and planarity. <P>SOLUTION: The polishing pad contains a non-aqueous matrix material containing a crosslinking polymer (crosslinkings 1, 2-polybutadiene or the like) and water soluble particles (a saccharide or the like) dispersed into it. In this case, the solubility of the water soluble particle to water is 0.1-10% by mass at 25°C and at the same time the degree of elution when the polishing pad is dipped into the water is 0.05-50% by mass at 25°C. Additionally, in the polishing pad, the solubility to water in a range from the pH 3 to pH 11 of the water soluble particle is 0.1-10% by mass at 25°C, and the solubility to water at 25°C in the range from the pH 3 to pH 11 is within±50% to the solubility to water at 25°C in the pH 7. Furthermore, in the polishing pad, the water soluble particle contains amino, epoxy, isocyanurate groups and the like. <P>COPYRIGHT: (C)2004,JPO</p> |
