| 摘要 |
An object of the invention is to provide a polishing and cleaning compound device in which it is possible to polish and clean a work piece in series and cleaning is started while the polishing is terminated. Thus, the polishing and cleaning compound device is constituted of: a polishing device unit in which a pair of cylindrical polishing tools vertically grip and hold a work piece transported from a container in which a plurality of thin disc-shaped work pieces are installed, the cylindrical polishing tools are rotated so as to pull the work piece up and polish the work piece as the work piece is rotated by rollers for rotation; and a cleaning device unit which is a circular shaped transporting mechanism and in which a plurality of hold means hold the work pieces polished in the polishing device unit and move to a specific position in turn to clean the work piece. Furthermore, in the polishing device unit, polishing process is carried out by supplying abrasive and cleaning process is carried out by supplying washing water.
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