| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein a zero contact point where a wafer W and a probe pin 8A are brought into electric contact with each other can not be determined exactly, while alignment between the wafer W and the probe pin 8A of a probe card 8 is performed when inspecting the wafer W by using a probe device. SOLUTION: This acquiring method of the contact position of the probe pin is characterized as follows: before performing an electric characteristic inspection of the wafer W by using the probe device, a reference probe card 21 is mounted on the probe device, and a reference wafer 22 having a conductive film is installed; after performing alignment between a probe pin 21A of the reference probe card 21 and the reference wafer 22, the reference probe card 21 and the reference wafer 22 are drawn close to each other based on the alignment position; and the position of the reference wafer 22 is acquired as contact position data when electric conduction between the probe pin 21A and a conductive film is generated in the state where the probe pin 21A wherein a voltage is applied to the reference probe card 21 is in contact with the conductive film without a stylus pressure. COPYRIGHT: (C)2004,JPO
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