发明名称 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
摘要 A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.
申请公布号 US2004106232(A1) 申请公布日期 2004.06.03
申请号 US20030704553 申请日期 2003.11.12
申请人 FUJITSU LIMITED 发明人 SAKUYAMA SEIKI;IMAIZUMI NOBUHIRO;YAGI TOMOHISA
分类号 H05K3/28;H01L21/56;H01L21/60;H05K3/32;H05K3/34;H05K3/46;(IPC1-7):H01L23/488 主分类号 H05K3/28
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