| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To give rigidity to a multilayer printed wiring board composed by overlapping a plurality of flexible printed boards. <P>SOLUTION: A plurality of flexible printed boards 3 where conductor circuit patterns 5 are formed in flexible insulating films 4 are overlapped on both faces of a substrate 2 whose rigidity is larger than the flexible printed boards 3 and in which through holes 9 are formed, and they are collectively heat-pressed in such a state. Thus, a plurality of the flexible printed boards 3 are mutually bonded, and the flexible printed boards 3 and the substrate 2 are mutually bonded so as to manufacture the multilayer printed wiring board 1. <P>COPYRIGHT: (C)2004,JPO</p> |
