METHOD FOR MANUFACTURING SURFACE MOUNT TYPE ELECTRICAL DEVICE USING CONDUCTIVE WIRE

摘要

PURPOSE: A method is provided to eliminate a wrap-around process for wrapping a conductive layer around the side surface of a thin film resistor element, by connecting upper and lower electrodes through the use of conductive wires. CONSTITUTION: A method comprises a step of preparing a thin film resistor sheet(20) having conductive wires(30,35) inserted, at a predetermined interval, in the thin film resistor sheet in such a manner that the conductive wires are exposed from first and second surfaces(22,24) of the thin film resistor sheet; a step of forming first and second conductive layers on the first and second surfaces of the thin film resistor sheet in such a manner that the first and second conductive layers are electrically connected to the conductive wires; a step of forming non-conductive gaps(46,56) by removing certain parts of the first and second conductive layers, respectively; a step of cutting the thin film resistor sheet in the direction of dividing the conductive wires; and a step of producing a plurality of electrical devices by dividing the thin film resistor sheet in the direction perpendicular to the conductive wires.