发明名称 ULTRASONIC BONDING METHOD AND ULTRASONIC BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic bonding method capable of efficiently transmitting ultrasonic vibrations by an application member to a bonding member so as to obtain good bonding quality, and capable of preventing the occurrence of tilting, cracking, chipping, etc. of the bonding member without requiring special work such as a chamfered part or the like to the bonding member. SOLUTION: This ultrasonic bonding method applies ultrasonic vibration to a bonding member 4 to bond it to a bonding surface 2. Both side faces in the direction of an ultrasonic vibration of the bonding member 4 are clamped by application members 10 and 17 applying predetermined ultrasonic vibrations and clamping members 35 and 37. The clamping members 35 and 37 are synchronously vibrated by the ultrasonic vibration transmitted from the application members 10 and 17 through the bonding member 4. The bonding member 4 is bonded to the bonding surface 2 in such a state that the bonding member 4 is pressed against the application members 10 and 17. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146786(A) 申请公布日期 2004.05.20
申请号 JP20030198279 申请日期 2003.07.17
申请人 MURATA MFG CO LTD 发明人 HIGASHIYAMA YUZO
分类号 B23K20/10;H01L21/00;H01L21/60;H01L21/607;(IPC1-7):H01L21/607 主分类号 B23K20/10
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