发明名称 METHOD AND APPARATUS FOR BAKING
摘要 PROBLEM TO BE SOLVED: To deal with many types of multi-surface patterns by hot plates of the number of a necessary minimum limit in baking. SOLUTION: A substrate G of a four-chamfering pattern conveyed at a period of a tact time is first conveyed to a baking unit (PREBAKE) 90 having the hot plate which has support pin disposing patterns corresponding to the four-chamfering patterns. A first (initial) baking is received in a first processing time shorter than the tact time. After a resist liquid film on the substrate is dried up to a state in which a pin transfer does not occur, the substrate is transferred to another baking units (PREBAKE) 92, 94, 100 and 102 of vacant states. Second (residual) baking is then received in a second processing time up to a substantially complete evaporation of an excess solvent in the resist film. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146625(A) 申请公布日期 2004.05.20
申请号 JP20020310565 申请日期 2002.10.25
申请人 TOKYO ELECTRON LTD 发明人 TAKAMORI HIDEYUKI
分类号 G03F7/38;G03F7/40;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/38
代理机构 代理人
主权项
地址