| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an etching method by which recessed and projecting sections can be formed highly efficiently with a short unit process time on the surface of a substrate, particularly, the substrate used for solar cells. <P>SOLUTION: An etching system roughens the surface of a substrate 1 by placing the substrate 1 on a cathode 9 provided to face an anode 18 by performing plasma etching on the substrate 1 by positioning a bar-like member or a meshed obstacle 15 between the substrate 1 and the anode 18. <P>COPYRIGHT: (C)2004,JPO</p> |
