| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent moldability useful for sealing a semiconductor and to provide a semiconductor device with the use of the composition which is excellent in soldering resistance and adhesiveness. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator and (D) a surface treated inorganic filler in which the surface is treated twice with a silan or siloxane. The semiconductor device is sealed by a cured product of the epoxy resin composition for sealing a semiconductor. COPYRIGHT: (C)2004,JPO
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